This article is cited in 2 papers

Mechanics

Experimental technique for determining the evolution of the bending shape of thin substrate by the copper electrocrystallization in areas of complex shapes

P. S. Bychkov^a, S. A. Lychev^a, D. K. Bout<sup>b

a</sup> IPMech RAS, 101-1, Prospect Vernadskogo, Moscow, 119526, Russian Federation
^b Bauman Moscow State Technical University, 5/1, ul. Baumanskaya 2-ya, Moscow, 105005, Russian Federation

Abstract: The present paper is aimed of experimental technique of local incompatible deformations' identification in thin layers obtained as a result of electrocrystallization. The process of electrocrystallization is carried on thin substrates. Changes in time of form of these thin substrates are registered during the experiment. Identification of local incompatible deformations' parameters is carried out from the condition of the minimum deflection of experimentally detected displacements and displacements that were determined by theoretical relations. As such a relationship the solution of a boundary value problem for a layer by layer growing plate is used in the paper. Significant difference of suggested technique from known methods is that testing electrocrystallization is carried out in areas of various forms. It allows to provide analysis of the influence that corner points of deposition area's boundary have on incompatible deformations caused by electrochemical process.

Keywords: electrocrystallization, thin substrate, residual stresses, distortion of shape, elasticity, incompatible deformations, experimental identification, holographic interferometry.

UDC: 629.7.05

Received: 07.10.2019
Accepted: 21.10.2019

DOI: 10.18287/2541-7525-2019-25-4-48-73