Abstract:
One way to reduce thermomechanical stresses in the processing of a beam-type sample on its side surface and a thin disk on its central circular hole by a laser beam is considered. The analytical expressions of temperature in both these cases are obtained. The problems of determining thermal stresses during the heating of samples with consideration of the heat transfer on their surfaces are solved. The solutions obtained when the heat transfer is present or absent are compared. It is shown that the blowing of the side surface can be used to suppress the destruction of heated samples.
Key words:thermal stresses, suppression of destruction, heat transfer.