Abstract:
A new method for fabricating large-area thin films of uniform thickness on a rotating substrate is proposed. Its distinctive features are (i) the presence of a diaphragm, partially transmitting the evaporated material, between the target and substrate and (ii) the translatory motion of the rotating substrate with respect to the target at a certain velocity. The method proposed makes it possible to obtain thin films of uniform thickness on substrates with sizes limited by only the deposition chamber size. The method is experimentally verified by depositing thin CuO films on silicon substrates placed over the radius of a disk 300 mm in diameter. The deviation of the film thickness from the average value does not exceed ±3% throughout the entire radius, which confirms good prospects of this method for microelectronics, optical industry, and other modern technologies.
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