A. L. Glazov, V. A. Kozlov, K. L. Muratikov, “Laser thermowave diagnostics of heat transfer through bonded interfaces in multielement semiconductor opening switches”, Pisma v Zhurnal Tekhnicheskoi Fiziki, 2011, Volume 37, Issue 24,Pages <nobr>16

This article is cited in 7 papers

Laser thermowave diagnostics of heat transfer through bonded interfaces in multielement semiconductor opening switches

A. L. Glazov^ab, V. A. Kozlov^ab, K. L. Muratikov^ab

^a Ioffe Institute, St. Petersburg
^b "FID Technology" Research and Production Association, St. Petersburg

Abstract: Laser thermowave photodeflection methods have been used to study the process of heat transfer in bonded interfaces of semiconductor diode structures of high-voltage opening switches fabricated according to the stack technology. A theoretical model is proposed for the description of thermal wave propagation in these structures with allowance for technological features of the preparation of semiconductor surfaces, brazing layers, and welds. It is shown that laser thermowave photodeflection methods can be used for diagnostics of the quality of bonded interfaces between elements of high-voltage opening switches fabricated by means of various technologies.

Received: 04.07.2011