This article is cited in 33 papers

Synthesis of Ti$_3$Al and TiAl based surface alloys by pulsed electron-beam melting of Al(film)/Ti(substrate) system

V. P. Rotshtein^ab, Yu. F. Ivanov^ab, Yu. A. Kolubaeva^ab, X. Mei^c, A. B. Markov^ab, E. P. Naiden^ab, G. E. Ozur^ab, K. V. Oskomov^ab, S. A. Popov^ab, E. L. Pryadko^ab, A. D. Teresov^ab, V. A. Shulov<sup>d

a</sup> Institute of High Current Electronics, Siberian Branch of the Russian Academy of Sciences, Tomsk
^b Tomsk State University
^c Dalian University of Technology
^d Moscow Aviation Institute

Abstract: Phase formation and surface hardening in the 100-nm-thick Al(film)/Ti(substrate) system under conditions of pulsed electron-beam melting ($\sim$15 keV, $\sim$3 $\mu$s, 3–4 J/cm$^2$) have been studied depending on the number of film deposition-melting cycles. Using this method, submicrocrystalline and nanocrystalline surface alloys with thicknesses $\ge$ 3 $\mu$m based on Ti$_3$Al and TiAl intermetallics have been obtained on the titanium substrate.

Received: 06.10.2010

 English version: Technical Physics Letters, 2011, 37:3, 226–229

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