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Pisma v Zhurnal Tekhnicheskoi Fiziki, 2025 Volume 51, Issue 13, Pages 49–53 (Mi pjtf7965)

Chemical vapor deposition of aluminum oxide thin films using aluminum isopropoxide as a precursor

A. S. Mitulinsky, A. V. Gaidaichuk, S. P. Zenkin, S. A. Linnik

Tomsk Polytechnic University

Abstract: The chemical vapor deposition process of aluminum oxide thin films using aluminum isopropoxide as a precursor was investigated. Deposition parameters enabling a high growth rate of up to $\sim$ 0.94 $\mu$m/min were identified. The resulting coatings were found to have an amorphous structure, with subsequent annealing at 1200$^\circ$C inducing crystallization and the formation of $\alpha$-Al$_2$O$_3$, $\kappa$-Al$_2$O$_3$, and $\gamma$-Al$_2$O$_3$ phases. It was demonstrated that aluminum isopropoxide allows the synthesis of high-purity coatings at relatively low deposition temperatures.

Keywords: chemical vapor deposition, thin films, aluminum oxide, thermal stability, thermal barrier coatings.

Received: 26.02.2025
Revised: 03.04.2025
Accepted: 10.04.2025

DOI: 10.61011/PJTF.2025.13.60705.20296



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