Abstract:
It is shown that the fluorine-containing anodic layers on the $n$-In$_{0.53}$Ga$_{0.47}$As surface, in contrast to the anodic layers without fluorine, form a SiO$_2$/InGaAs interface with an unpinned Fermi level, the state density on which decreases during annealing at a temperature of 300$^{\circ}$C to values (2 – 4) $\times$ 10$^{11}$ and (4 – 5) $\times$ 10$^{12}$ eV$^{-1}$cm$^{-2}$ near conduction band bottom and the band gap middle, respectively. An increase in the annealing temperature leads to a reverse increase in the state density (350$^\circ$Ñ) and pinning of the Fermi level (400$^\circ$Ñ).
Keywords:In$_{0.53}$Ga$_{0.47}$As, anodic oxide layer, fluorine, $C$–$V$ characteristics, density of interface states.