Abstract:
Silicon light-emitting diode structures with a near-band-edge luminescence have been studied by the EBIC method. The structures were fabricated by ion implantation with different temperatures of the final stage of the postimplantation annealing (950 and 1000$^\circ$C). Upon raising the annealing temperature, the diffusion length of minority carriers increases from 1–2 to 25–35 $\mu$m in the light-emitting diode region in which the near-band-edge luminescence occurs. Also, the distribution of nonradiative recombination centers in this region becomes less nonuniform in the lateral direction, parallel to the plane of the p-n junction. It is these factors that lead to the observed substantial increase in the intensity of the near-band-edge luminescence.