Abstract:
New possibilities of improving depth resolution of SIMS depth profiling of GeSi/Si heterostructures using a TOF.SIMS-5 spectrometer are discussed. Contributions of ion sputtering artifacts and instrumental effects to depth resolution were analyzed in detail using a Talysurf CCI-2000 optical profilometer to control the shape and roughnesses of the sputtering crater bottom. It was found that the use of Cs$^+$ ions for sputtering makes it possible to minimize roughness development during depth profiling of GeSi/Si structures to depths of 1–1.5 $\mu$m. It was shown that the use of secondary cluster ions Ge$_2^-$ and Ge$_3^-$ instead of Ge$_1^-$ and Ge$^+$ allows narrowing the transition regions in measured profiles.