Abstract:
Comparative analysis of the influence of thermal annealing on Ge/Au/Ni-, Ge/Au/Ti/Au-, and Ge/Au/Ni/Ti/Au-based ohmic contacts and Ti/Au-based Schottky contacts deposited on an $n$-GaAs (100) surface treated and nontreated in (NH$_4$)$_2$S aqueous solution have been performed. Annealing conditions for ohmic contacts are found that lead to a decrease in the specific contact resistance of sulfur-treated samples by a factor of 2.5–15 in comparison with the nontreated samples. Optimal annealing conditions are also determined for sulfur-treated GaAs samples with Schottky contacts, which make it possible to reduce the ideality factor and increase the barrier height and the breakdown voltage with respect to the nontreated samples.