Abstract:
Processes are considered in which ultrathin layers of III–V ternary solid solutions are formed via the delivery of Group-V element vapors to GaAs and GaSb semiconductor plates, with solid-phase substitution reactions occurring in the surface layers of these plates. This method can form defect-free GaAs$_{1-x}$P$_x$, GaAs$_x$Sb$_{1-x}$, and GaP$_x$Sb$_{1-x}$ layers with thicknesses of 10–20 nm and a content x of the embedded components of up to 0.04.