Abstract:
The possibility of decreasing the resistivity of ohmic contact to $p$- and $n$-type diamond epitaxial layers by using heavily boron- and phosphorus-alloyed layers, variation of different materials for metallization and annealing of contacts has been investigated. Two types of ohmic contacts have been studied: Ti/Mo/Au and Ti/Pt/Au. The use of platinum as a diffusion barrier in a three-layer system made it possible to reduce the specific contact resistance to $p$-type diamond by an order of magnitude compared to molybdenum to 2.7 $\cdot$ 10$^{-6}$$\Omega$$\cdot$ cm$^2$, which maintains stability during high-temperature annealing. A specific resistance of ohmic contacts to $n$-type diamond of 0.02$\Omega$$\cdot$ cm$^2$ has been achieved. The current-voltage characteristic of the resulting contacts is linear.
Keywords:epitaxial layers of diamond, boron, phosphorus, ohmic contacts.