Abstract:
The study presents calculations of temperature fields in controlled laser thermal cleaving of brittle non-metallic
materials using two laser beams with a coolant. An estimation of the upper limit of thermal micro-stress was conducted based
on the temperature distribution data across the surface and within the volume of the materials. This information is essential for
the substantiated selection of laser processing parameters for the specified materials, particularly quartz and silicate glasses,
in microelectronics manufacturing processes.
Keywords:laser radiation, temperature field, micromechanical thermoelastic stresses, mathematical modeling.
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