PHYSICS

Influence of copper nanoparticle film processing temperature on their structure and electrical properties

N. N. Begletsova^ab, A. J. K. Al-Alwani^ac, V. S. Atkin^a, V. P. Sevostyanov^b, E. G. Glukhovskoy<sup>ba

a</sup> Saratov State University, Astrakhanskaya, 83, Saratov, 410012, Russia
^b Scientifc Research Institute of Technology of Organic, Inorganic Chemistry and Biotechnology, Bolshaya Sadovaya, 239, Saratov, 410005, Russia
^c Babylon University, Babylon, Iraq

Abstract: This work is devoted to the study of the influence of the additional processing at 100, 200 and 300$^\circ$ C on the morphology, microrelief, elemental composition of the surface and the electrophysical properties of glass/ITO/copper nanoparticle film structures. Studies have shown that with an increase in the processing temperature of the investigating samples reduces the amount of organic matter protecting the copper particles from oxidation. The conductivity of copper nanoparticles increases. The morphology of the surface and the elemental composition of the samples were studied by scanning electron microscopy. The microrelief of the surface and the measurement of the copper nanoparticles current-voltage characteristics were carried out using a scanning probe microscope in atomic force and scanning tunneling microscopy modes.

Keywords: Copper nanoparticles, surface morphology and microrelief, elemental composition, current-voltage characteristics.

PACS: 61.46.+w, 73.25.+i, 79.60.Bm

Received: 27.06.2018
Revised: 27.08.2018

Language: English

DOI: 10.17586/2220-8054-2018-9-5-586-596

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