Abstract:
The effect of the state of stress at a film–substrate interface on the elastic deformation of Ti films is studied during alternating bending. The Al substrate compliance is shown to cause coherent deformation of the film–substrate system, resulting in the corrugation of a Ti film and the appearance of a wavelike film–substrate interface. Fatigue tests lead to the formation of a periodic distribution of normal and tangential stresses along the interface, and this distribution favors periodic film corrugation. The corrugation of a Ti film on a Ti substrate occurs randomly in local film separation areas and is caused by defects accumulated at the interface.
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