Abstract:
HfO$_2$ films 5 nm thick grown on Si(100) substrates by the methods of MOCVD hydride epitaxy and atomic layer deposition (ALD) are studied using X-ray photoelectron spectroscopy combined with Ar$^+$ ion etching and X-ray reflectometry. It is found that (i) the ALD-grown HfO$_2$ films are amorphous, while the MOCVD-grown films show signs of a crystal structure; (ii) the surface of the ALD-grown films is more prone to contamination and/or is more reactive; and (iii) the amount of interfacial silicon dioxide in the case of the MOCVD-grown film is greater than in the case of the films synthesized by ALD. It is also shown that the argon ion etching of the HfO$_2$ film results in the formation of a metallic hafnium layer at the interface. This indicates that HfO$_2$ can be used not only as a gate dielectric but also as a material suitable for fabricating nanodimensional conductors by direct decomposition.