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Zhurnal Tekhnicheskoi Fiziki, 2025 Volume 95, Issue 10, Pages 1914–1923 (Mi jtf8576)

XXIX Symposium "Nanophysics and Nanoelectronics" in Nizhny Novgorod, March 10-14, 2025
Physical electronics

Niobium nitride ultra-thin film chemical and phase depth profiling

O. I. Lubenchenko, A. V. Lubenchenko, D. S. Lukyantsev, D. A. Ivanov, I. V. Ivanova, O. N. Pavlov

National Research University "Moscow Power Engineering Institute"

Abstract: This work reports on investigation of ultra-thin niobium and niobium nitride films. The films differ by substrates, presence of a buffer layer, oxidation time and rate, ion beam irradia-tion. Depth profiling of niobium nitride thin films has been performed by means of X-ray photoe-lectron spectroscopy. It has been found that a layer of a modified phase of niobium nitride is formed under the oxide layer; when an ultra-thin niobium nitride film is deposited on an oxidized silicon substrate by the magnetron sputtering method, an interface layer about 1 nm thick is gen-erated; no interface layer is formed by depositing of an ultra-thin niobium nitride film on a sap-phire substrate; the oxide layer thickness and phase compound depends on oxidation time and rate of the niobium nitride film; under ion beam irradiation, both thickness and phase compound of the irradiated NbN film change.

Keywords: niobium nitride, ultra-thin films, X-ray photoelectron spectroscopy, chemical and phase depth profiling.

Received: 25.04.2025
Revised: 25.04.2025
Accepted: 25.04.2025

DOI: 10.61011/JTF.2025.10.61345.66-25



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