Abstract:
Heat release in the cryogenic system of a subterahertz-range superconducting integrated detector at $\approx$ 4.2 K is studied, and the influence of the released heat on its main characteristics is estimated. The detector chip mounted on a silicon lens is connected to a bias board by aluminum wires 25 $\mu$m in diameter, which are fixed by ultrasonic bonding. They are necessary for setting a bias current through the working components of the detector and represent an integral part of the system. The contact resistance between the wires and contact pads of the microchip is measured. The contact resistance is found to considerably exceed the resistance of the aluminum wire and, hence, makes a major contribution to heat release in the system. A “multipoint contact with one wire” technique is suggested. Tests show its efficiency: the contact resistance decreases considerably compared with the standard approach.
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