Solid-state synthesis of Cu$_6$Sn$_5$ intermetallic in Sn/Cu thin films

Liudmila E. Bykova^a, Victor G. Myagkov^a, Yuri Yu. Balashov^a, Victor S. Zhigalov^a, Gennady S. Patrin<sup>ba

a</sup> Kirensky Institute of Physics Federal Research Center KSC SB RAS, Krasnoyarsk, Russian Federation
^b Siberian Federal University Krasnoyarsk, Russian Federation

Abstract: The study results of solid-state synthesis of the Cu$_6$Sn$_5$ intermetallic in the Sn/Cu thin-film systems during vacuum annealing from room temperature to $300^\circ$C are presented. The initiation and finishing temperatures of the solid-state reaction between the Cu and Sn nanolayers and the phase composition of the reaction products were determined. The synthesized thin films were monophasic and consisted of the hexagonal $\eta$-Cu$_6$Sn$_5$ phase. It is assumed that the initiation temperature of the solid-state reaction in Sn/Cu thin films is associated with the start temperature of the reverse polymorphic transformation $\eta' \rightarrow \eta$ between the monoclinic and hexagonal Cu$_6$Sn$_5$ phases.

Keywords: thin films, solid-state synthesis, Cu$_6$Sn$_5$ intermetallic, $\eta \leftrightarrow \eta'$ reversible polymorphic transformations.

UDC: 537.9

Received: 16.12.2021
Received in revised form: 11.02.2022
Accepted: 20.03.2022

Language: English

DOI: 10.17516/1997-1397-2022-15-4-493-499