Abstract:
Grazing incidence X-ray diffraction (GIXRD) data have indicated that the orthorhombic $Pmn{{2}_{1}}$ phase previously detected in a $10$–$20$ nm buried ferroelectric HfO$_2$ : Al$_2$O$_3$ (10:1) layer of silicon-on-insulator and silicon-on-sapphire structures after annealing at $T > 950^\circ$ C for $1$ h is absent after $30$ s stepwise rapid thermal annealing treatments. Instead, stressed textured ferroelectric layers thermally stable up to $1000^\circ$ C are formed with the $\{111\}$ and $\{002\}$ orientations for silicon and sapphire substrates, respectively, in the rhombohedral $rR3$ or orthorhombic $Pca{{2}_{1}}$ phases, which are not manifested in GIXRD patterns. The high remnant polarization in silicon-on-insulator structures indicates that the rhombohedral $rR3$ phase is favorable.