Abstract:
A description of the fabrication technology of high-quality tunnel SIS junctions is presented, with following characteristics: energy gap in superconductors $V_g$ = 3.2–3.4 mV, tunnel current density up to $J$ 35 kA/cm$^2$, quality factor $R_j/R_n$ (ratio of subgap resistance to normal-state resistance) up to 30, junction area up to 1 $\mu$m$^2$. The SIS junctions are integrated into the NbTiN|SiO$_2$|Al microstrip line.