Abstract:
Numerical simulation is used to analyze the operation of a semiconductor tin-monosulfide thermocouple. The element is used to record exothermic processes in shock-recovery experiments. We solved the problem in a one-dimensional formulation by considering a multilayer scheme that models the location of the sample and the thermocouple inside a real flat capsule. Numerical calculations yield time dependences of the thermal electromotive force (EMF) at various heat-release rates in the substance under study.
